In the realm of advanced manufacturing, a groundbreaking development is set to revolutionize the way we think about soft electronics, particularly in the energy sector. Researchers at Xi’an Jiaotong University, led by Chengjun Zhang, have pioneered a new method for creating high-density interconnect (HDI) soft electronics using femtosecond laser direct writing (FLDW) technology. This innovative approach promises to integrate multiple functions into a single, miniaturized system, opening up new possibilities for smart healthcare, soft robotics, and human-machine interactions.
The challenge in developing 3D soft electronics has always been achieving high resolution and high integration while ensuring reliable interlayer electrical conductivity. Traditional methods often fall short in guaranteeing precise interlayer alignment of high-density vias. Zhang’s team has addressed this issue head-on by leveraging the high spatial resolution and precision of FLDW. This technology allows for the maskless fabrication of high-resolution embedded liquid metal (LM) microchannels and high-density vertical interconnect accesses, essential for 3D integrated circuits.
What sets this research apart is the use of supermetalphobicity—a phenomenon induced during laser ablation that creates high-aspect-ratio blind/through LM microstructures inside the elastomer. This breakthrough enables the creation of LM-based HDI circuits with unprecedented resolution and integration capabilities. “Our method achieves a resolution of approximately 1.5 micrometers and supports up to 10-layer electrical interconnections,” Zhang explains. “This level of precision and integration is crucial for developing customized soft electronics, including multilayer passive electric components, soft multilayer circuits, and cross-scale multimode sensors.”
The implications for the energy sector are profound. Imagine soft electronics that can be seamlessly integrated into wearable devices, monitoring energy consumption and optimizing efficiency in real-time. Or consider the potential for advanced sensors that can detect and respond to changes in energy distribution networks, ensuring stability and reliability. The versatility of this 3D laser printing method provides a pathway for developing chip-level soft electronics that can be tailored to specific energy applications.
The research, published in the International Journal of Extreme Manufacturing (translated to English) highlights the potential of FLDW in pushing the boundaries of what is possible in soft electronics. As Zhang notes, “This technology opens up new avenues for innovation, particularly in fields where precision and integration are paramount.” The energy sector, with its ever-increasing demand for efficient and reliable solutions, stands to benefit significantly from these advancements.
As we look to the future, the work of Zhang and his team at Xi’an Jiaotong University paves the way for a new era in soft electronics. The ability to create high-density interconnects with unparalleled precision and integration will drive innovation in various industries, but perhaps none more so than energy. The potential for smart, adaptable, and efficient energy solutions is within reach, and this research brings us one step closer to realizing that vision.