In the high-stakes world of semiconductor manufacturing, where the slicing of hard and brittle materials like monocrystalline silicon and sapphire is a daily challenge, a groundbreaking study has emerged that could revolutionize the industry. Led by Jiahu Chen from the School of Mechanical Engineering at Shandong University, the research delves into the intricate dynamics of cutting fluid flow in the kerf of fine diameter diamond wire saws, a critical component in the production of high-quality wafers.
As the demand for larger wafers and thinner, more precise cuts grows, so does the complexity of the cutting process. The kerf—the narrow gap created by the saw—becomes deeper and narrower, making it increasingly difficult for cutting fluids to penetrate and provide adequate lubrication and cooling. This challenge is particularly acute in the energy sector, where the production of solar panels and other semiconductor devices relies heavily on the quality of these wafers.
Chen’s study, published in ‘Jin’gangshi yu moliao moju gongcheng’ (translated to ‘Diamond and Abrasive Tools Engineering’), employs computational fluid dynamics (CFD) to simulate the flow of cutting fluids in the kerf. The findings are both illuminating and practical. “With the increase of chip size and the decrease of wire saw diameter, the size of the saw seam is getting smaller and smaller,” Chen explains. “The main fluid entering the saw seam is shear flow, and the main factor affecting the fluid motion state is the wire speed.”
The research reveals that at low wire speeds (vw≤25 m/s), the cutting fluid struggles to fully enter the sawing area, leading to inadequate lubrication and cooling. However, as the wire speed increases (vw>25 m/s), the contact and non-contact areas of the saw wire become fully saturated with liquid, stabilizing the pressure distribution and enhancing the cutting fluid’s effectiveness. Chen notes, “When the contact area and non-contact area are full of cutting fluid, the cutting fluid pressure distribution in the saw joint is relatively stable, with the pressure in the contact area being about 0.1790 MPa and the pressure in the non-contact area being about 0.1590 MPa.”
Moreover, the study highlights the importance of cutting fluid properties. Reducing the viscosity and surface tension of the cutting fluid within a certain range can improve its saturation and stability in the kerf, leading to a more stable pressure distribution. This finding could have significant commercial implications for the energy sector, where optimizing cutting fluid properties could lead to higher quality wafers and more efficient production processes.
The implications of this research are far-reaching. As the demand for renewable energy solutions continues to rise, the ability to produce high-quality wafers efficiently and cost-effectively becomes paramount. Chen’s work provides a roadmap for optimizing the cutting process, potentially leading to advancements in solar panel technology, semiconductor devices, and other energy-related applications.
For industry professionals, this research offers a glimpse into the future of wafer production. By understanding and controlling the flow of cutting fluids, manufacturers can enhance the quality of their products, reduce waste, and improve overall efficiency. As Chen’s study demonstrates, the key to unlocking these benefits lies in the intricate dance of fluid dynamics within the kerf.