In the ever-evolving landscape of semiconductor packaging, a groundbreaking study published in ‘Cailiao gongcheng’ (Materials Engineering) is set to revolutionize the way bumps are prepared for chip packaging. Led by DONG Wei from the School of Materials Science and Engineering at Dalian University of Technology, this research delves into the pulsated orifice ejection method (POEM), offering a glimpse into the future of micro-droplet ejection and size-on-demand technology.
At the heart of this innovation lies the SAC305 commercial lead-free solder, a material widely used in the electronics industry. The study, conducted by DONG Wei and his team, explores the intricate dance of parameters such as pulse waveform, the distance between the transmission rod and the orifice, and the orifice diameter. These factors play a pivotal role in the stability and size control of the ejected droplets, crucial for the direct preparation of bumps in chip packaging.
“The stability of micro-droplet ejection and size-on-demand are not just technical challenges; they are the cornerstones of reliable and efficient chip packaging,” DONG Wei explains. The team’s experiments revealed that by meticulously coordinating these key process parameters, they could achieve a remarkable deviation of just 4% between the target and actual particle size. This level of precision is a game-changer for the industry, ensuring the stable on-demand preparation of bumps.
But the implications of this research extend far beyond the lab. In the energy sector, where the demand for high-performance, reliable electronics is ever-growing, this technology could pave the way for more efficient and durable semiconductor packages. Imagine solar panels with more efficient energy conversion, or wind turbines with more reliable control systems—all made possible by the precise and stable bumps prepared using POEM.
The study also sheds light on the cooling rates during droplet solidification. The researchers found that the cooling rate in an argon atmosphere is significantly lower than in a helium atmosphere, resulting in a coarser microstructure. This insight could lead to new strategies for controlling the microstructure of solder bumps, further enhancing their performance and reliability.
The direct deposition of bumps on a copper plate, forming a metallurgical layer, demonstrates the feasibility of this technology. “This is not just about creating bumps; it’s about creating a new way of thinking about semiconductor packaging,” DONG Wei adds. The potential for this technology to disrupt the industry is immense, offering a new path for the direct preparation of bumps that could redefine the standards of efficiency and reliability.
As the world continues to push the boundaries of technology, research like this serves as a beacon, guiding us towards a future where precision and reliability are not just goals, but standards. The work published in ‘Cailiao gongcheng’ (Materials Engineering) is a testament to the power of innovation and the relentless pursuit of excellence. It’s a story of how a simple method can lead to extraordinary outcomes, shaping the future of the semiconductor industry and beyond.
