In the relentless pursuit of advanced materials, a breakthrough in the realm of copper-nanocrystalline diamond composites has emerged, promising to revolutionize the energy sector. Researchers at the College of New Materials and New Energies, Shenzhen Technology University, led by Xing Haojie, have developed a method to deposit adherent diamond films on copper, a feat previously hindered by thermal mismatch and poor bonding. This innovation could significantly enhance the performance and longevity of electronic circuits, particularly in high-power applications.
The challenge of depositing diamond films on copper has long perplexed scientists due to the high thermal mismatch and bonding issues between the two materials. However, Xing Haojie and his team have devised a solution that combines abrasion with microdiamond and the deposition of a thin titanium interlayer. This combination has proven conducive to the final coating performance, addressing the long-standing adhesion problem.
“The key to our success lies in the mechanical interlocking and chemical bonding established during the process,” Xing Haojie explained. “The titanium interlayer not only serves as a compliant buffer for thermal stress but also forms carbides that chemically bond with the diamond film.”
The research, published in Functional Diamond, which translates to Functional Diamond in English, details how the team mitigated thermal stress by reducing the deposition temperature to 650°C and using the titanium interlayer as a buffer. This approach resulted in diamond films that did not spontaneously delaminate after cooling, achieving an impressive adhesion strength of approximately 68.5 MPa.
The implications for the energy sector are profound. The high resistivity and superior thermal transport properties of the nanocrystalline diamond film offer novel options for electronic circuit design. This could lead to improved heat dissipation, a critical factor in the performance and reliability of high-power electronics. Moreover, the simplified production process could reduce manufacturing costs, making advanced electronic components more accessible.
The potential applications extend beyond the energy sector. Industries such as aerospace, automotive, and telecommunications could also benefit from these advancements. The enhanced thermal management capabilities could lead to more efficient and reliable electronic devices, pushing the boundaries of what is possible in various technological domains.
As the world continues to demand more from its electronic devices, the need for materials that can withstand high temperatures and provide superior thermal management becomes increasingly important. This research by Xing Haojie and his team at Shenzhen Technology University represents a significant step forward in meeting these demands. The future of electronic circuit design may well be shaped by the innovative use of copper-nanocrystalline diamond composites, paving the way for a new era of technological advancements.
