In the rapidly evolving world of electronics, where artificial intelligence and miniaturized chips are pushing the boundaries of technology, a critical challenge emerges: heat. As electronic chips become smaller and more integrated, their volumetric heating power surges, threatening their performance and longevity. Enter Sun Jian, a researcher who has been exploring innovative solutions to this pressing issue.
Sun Jian, whose affiliation is not specified, has delved into the realm of boiling heat transfer, focusing on the use of porous microjets in heat sinks. The study, published in *Zhileng xuebao*, which translates to *Acta Armamentarii* or *Journal of Armament*, explores how these tiny jets can effectively cool down high-powered electronic chips.
The research team designed a heat sink with an array of finned porous microjets and used HFE-7100, a cooling medium known for its thermal stability and electrical insulation. Through a combination of numerical simulations and experimental research, they investigated various factors influencing the heat transfer process of microjet boiling.
One of the key findings was the optimal structure with an aspect ratio of 0.5, which met the cooling requirements of electronic chips and demonstrated superior cooling effects. “The optimized structure showed a significant improvement in heat transfer,” Sun Jian noted. “This is a crucial step towards ensuring the reliable operation of high-performance electronic devices.”
In the single-phase convection heat transfer stage, the study found that increasing the volume flow rate or jet Reynolds number could enhance convection heat transfer, with the maximum heat transfer coefficient reaching an impressive 15,724.40 W/(m²·K). However, in the jet boiling stage, the heat flux corresponding to the onset of nucleate boiling (ONB) decreased with a decrease in the inlet subcooling degree. Increasing the inlet volume flow rate or jet Reynolds number inhibited boiling, thus weakening heat transfer. Despite this, the heat transfer coefficient in the boiling stage was still 20.6% higher than in the single-phase convective heat transfer stage.
The implications of this research are profound for the energy sector, particularly in the development of more efficient cooling systems for high-performance electronics. As the demand for powerful and compact electronic devices continues to grow, the need for effective cooling solutions becomes ever more critical. Sun Jian’s work offers a promising avenue for addressing this challenge, potentially shaping the future of electronic design and manufacturing.
“This research not only advances our understanding of boiling heat transfer but also paves the way for practical applications in the cooling of electronic chips,” Sun Jian explained. “The insights gained from this study can be instrumental in developing next-generation cooling technologies.”
As the world moves towards more advanced and energy-efficient technologies, the work of researchers like Sun Jian becomes increasingly vital. Their contributions are not just academic exercises but practical steps towards solving real-world problems, driving innovation, and shaping the future of the energy sector.