In the realm of advanced packaging, a groundbreaking development has emerged that could revolutionize the way we approach wafer-level and panel-level manufacturing. Researchers, led by Huijuan Liu from the Shenzhen Institute of Advanced Electronic Materials and the University of Science and Technology of China, have introduced a novel method for creating laser-induced graphite films (LIGF) that promises to enhance the efficiency and safety of photonic debonding processes.
Photonic debonding, a technique used to separate components in advanced packaging, has long been hampered by the limitations of conventional metal-based release materials. These materials often require high-power equipment and can be time-consuming and energy-intensive, posing significant safety concerns. The new LIGF method, however, addresses these challenges head-on.
The key to this innovation lies in the unique “flat bone” multiscale nanostructure of the LIGF, which enables an absorption rate of over 95% across a broad wavelength range of 200–1,100 nm. This dramatic improvement in photothermal conversion efficiency means that the photonic debonding process can be completed with less energy and in a fraction of the time.
“Our method not only reduces the energy requirements but also ensures a cleaner separation interface, free from carbon debris, and allows for multiple reuses of the release layer,” explained Liu. This reusability, combined with the material’s exceptional thermal and chemical resistance, makes LIGF a highly cost-effective and environmentally friendly option for industrial applications.
The implications for the energy sector are profound. As the demand for advanced packaging solutions continues to grow, particularly in the electronics and semiconductor industries, the need for efficient and reliable debonding techniques becomes ever more critical. The LIGF method offers a promising solution that could significantly enhance the productivity and sustainability of these industries.
Moreover, the ultra-low transmittance of the LIGF release layer prevents light leakage-induced damage to the device surface, ensuring the integrity and performance of the final product. This feature is particularly valuable in the production of high-precision components where even minor defects can have significant consequences.
The research, published in the International Journal of Extreme Manufacturing (which translates to “International Journal of Extreme Manufacturing” in English), represents a significant step forward in the field of advanced packaging. As the industry continues to evolve, innovations like the LIGF method will play a crucial role in shaping its future.
This development is not just a technological advancement; it’s a testament to the power of innovative thinking and the potential for transformative change in the energy sector. As we look to the future, the possibilities are endless, and the impact of this research could be felt far and wide.